Advantages：
Miniaturization and high-density layout: The pin spacing can be as small as 0.3mm, without the need for vias, and supports double-sided PCB layout, significantly saving space and enhancing wiring density19.
High compatibility for automated production: Using tape and reel packaging, it is compatible with vacuum suction of surface mount machines and one-time reflow soldering, significantly improving production efficiency and consistency110.
Excellent high-frequency performance: Short leads and small loop areas are conducive to high-speed signal integrity, suitable for high-frequency scenarios such as communication and radio frequency9.
Little substrate damage: The design without drilling avoids the structural damage to PCB and aluminum substrate caused by traditional through holes110.
High temperature resistance and flame retardancy: Usually uses V-0 flame retardant grade materials, which can withstand a reflow soldering temperature of 260°C and maintain for 15–30 seconds110.
Good coplanarity: Some products adopt technologies such as “floating anchor” to ensure that components are fully adhered to the substrate, improving welding reliability110.
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